|
型号:ZSC31010CIG1-R
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSC31014EAC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSC31010CEG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs状态:RoHS
|
|
型号:ZSC31014BOARDV2P1S
|
制造商:
|
描述:SSC BOARD ZSC31014 V2.1 WITH SAM
|
RoHs状态:RoHS
|
|
型号:ZSC31010MCREFBV1P0
|
制造商:
|
描述:ZSC31010 MASS CALIBR. REF. BOARD
|
RoHs状态:RoHS
|
|
型号:ZSC31010CEG1-T
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSC31014KITV2P1
|
制造商:
|
描述:ZSC31014KIT EVALUATION KIT V2.1
|
RoHs状态:RoHS
|
|
型号:ZSC31010KITV2P1
|
制造商:
|
描述:ZSC31010KIT EVALUATION KIT V2.1
|
RoHs状态:RoHS
|
|
型号:ZSC31014EAG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs状态:RoHS
|
|
型号:ZSC31010MCSV1P1
|
制造商:
|
描述:ZSC31010 MASS CALIBRATION SYSTEM
|
RoHs状态:RoHS
|
|
型号:ZSC31010CIC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSC31010CIB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSC31014EID
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSC31014EAG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs状态:RoHS
|
|
型号:ZSC31014EIG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs状态:RoHS
|
|
型号:ZSC31014EIG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs状态:RoHS
|
|
型号:ZSC31014EIC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSC31010CIG1-T
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSC31014EAD
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSC31014EIB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|