|
型号:ZSC31015EEC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSC31015EEB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSC31050FAG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 16SSOP
|
RoHs状态:RoHS
|
|
型号:ZSC31015EIB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSC31015MCSV1P1
|
制造商:
|
描述:ZSC31015 MASS CALIBRATION SYSTEM
|
RoHs状态:RoHS
|
|
型号:ZSC31015EIG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs状态:RoHS
|
|
型号:ZSC31015KITV1P1
|
制造商:
|
描述:ZSC31015KIT EVALUATION KIT V1.1
|
RoHs状态:RoHS
|
|
型号:ZSC31050FEC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSC31015EEG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs状态:RoHS
|
|
型号:ZSC31050FAD
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSC31050FEB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSC31050BOARDV3P1S
|
制造商:
|
描述:SSC BOARD ZSC31050 V3.1 WITH SAM
|
RoHs状态:RoHS
|
|
型号:ZSC31015EED
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSC31015EIC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSC31015EEG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs状态:RoHS
|
|
型号:ZSC31015EIG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs状态:RoHS
|
|
型号:ZSC31050FED
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSC31050FAC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSC31050FAB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSC31050FAG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 16SSOP
|
RoHs状态:RoHS
|