|
型号:ZSC31150GAB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSC31150GLG1-R
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSC31150GEC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSC31050MCSV1P1
|
制造商:
|
描述:ZSC31050 MASS CALIBRATION SYSTEM
|
RoHs状态:RoHS
|
|
型号:ZSC31050FIG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 16SSOP
|
RoHs状态:RoHS
|
|
型号:ZSC31050MCREFBV1P0
|
制造商:
|
描述:ZSC31050 MASS CALIBR. REF. BOARD
|
RoHs状态:RoHS
|
|
型号:ZSC31150GEB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSC31150GAD
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSC31150GAG2-R
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSC31150GAG2-V
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSC31150GEG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 14SSOP
|
RoHs状态:RoHS
|
|
型号:ZSC31150BOARDV1P2S
|
制造商:
|
描述:SSC BOARD ZSC31150 V1.2 WITH SAM
|
RoHs状态:RoHS
|
|
型号:ZSC31150GEG2-V
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSC31050KITV3P1
|
制造商:
|
描述:ZSC31050KIT EVALUATION KIT V3.1
|
RoHs状态:RoHS
|
|
型号:ZSC31150GAC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSC31150GEG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 14SSOP
|
RoHs状态:RoHS
|
|
型号:ZSC31150GEG2-R
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSC31150GAG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 14SSOP
|
RoHs状态:RoHS
|
|
型号:ZSC31150GED
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSC31050FIG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 16SSOP
|
RoHs状态:RoHS
|