|
型号:ZSSC3018BA1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3016CI6B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3016KITV1P1
|
制造商:
|
描述:ZSSC3016KIT EVALUATION KIT V1.1
|
RoHs状态:RoHS
|
|
型号:ZSSC3018BA1C
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSSC3016DI1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3015NE1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3016CC6B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3016CI1C
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSSC3016BOARDV1P1
|
制造商:
|
描述:ZSSC3016 ANALOG-DIGITAL-BOARD V1
|
RoHs状态:RoHS
|
|
型号:ZSSC3015NE1C
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSSC3016CC1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3015NE2R
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSSC3015NE1D
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSSC3015NA2T
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSSC3016CI1BP
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3016CI1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3015NA1C
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSSC3015NA2R
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSSC3016DI6B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3015NE2T
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|