|
型号:ZSSC313XBOARDV1P2S
|
制造商:
|
描述:SSC BOARD ZSSC313X V1.2 WITH SAM
|
RoHs状态:RoHS
|
|
型号:ZSSC3136BE2T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 14SSOP
|
RoHs状态:RoHS
|
|
型号:ZSSC3138BA1D
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSSC3138BA1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC313XMCSV1P1
|
制造商:
|
描述:ZSSC313X MASS CALIBRATION SYSTEM
|
RoHs状态:RoHS
|
|
型号:ZSSC3138BE2T
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSSC3138BE1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3138BA2R
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BA1C
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BA3R
|
制造商:
|
描述:IC INTFACE SPECIALIZED 32VFQFPN
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BA1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC313XKITV1P1
|
制造商:
|
描述:ZSSC313XKIT EVALUATION KIT V1.1
|
RoHs状态:RoHS
|
|
型号:ZSSC3138BE1D
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSSC3138BA2T
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSSC313XBOARDV1P1S
|
制造商:
|
描述:SSC BOARD ZSSC313X V1.1 WITH SAM
|
RoHs状态:RoHS
|
|
型号:ZSSC3136BE2R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 14SSOP
|
RoHs状态:RoHS
|
|
型号:ZSSC3138BA1C
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BA1D
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSSC3138BE1C
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSSC313XMCREFBV1P0
|
制造商:
|
描述:ZSSC313X MASS CALIBR. REF. BOARD
|
RoHs状态:RoHS
|