|
型号:ZSSC3170EA1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BE1D
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSSC3170EA3V
|
制造商:
|
描述:IC INTERFACE
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BOARDV1P2S
|
制造商:
|
描述:SSC BOARD ZSSC3154 V1.2 WITH SAM
|
RoHs状态:RoHS
|
|
型号:ZSSC3154KITV1P1
|
制造商:
|
描述:ZSSC3154KIT EVALUATION KIT V1.1
|
RoHs状态:RoHS
|
|
型号:ZSSC3170EA2T
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSSC3170EA1D
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BE3R
|
制造商:
|
描述:IC INTFACE SPECIALIZED 32VFQFPN
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BE1B
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BE1C
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BA3V
|
制造商:
|
描述:IC INTFACE SPECIALIZED 32VFQFPN
|
RoHs状态:RoHS
|
|
型号:ZSSC3170EA1C
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs状态:RoHS
|
|
型号:ZSSC3170BOARDV2P1S
|
制造商:
|
描述:SSC BOARD ZSSC3170 V2.1 WITH SAM
|
RoHs状态:RoHS
|
|
型号:ZSSC3170EA3R
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSSC3154KITV1P0
|
制造商:
|
描述:ZSSC3154KIT EVALUATION KIT V1.0
|
RoHs状态:RoHS
|
|
型号:ZSSC3154MCREFBV1P0
|
制造商:
|
描述:ZSSC3154 MASS CALIBR. REF. BOARD
|
RoHs状态:RoHS
|
|
型号:ZSSC3170EA2R
|
制造商:
|
描述:IC INTFACE SPECIALIZED SGNL COND
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BE3V
|
制造商:
|
描述:IC INTFACE SPECIALIZED 32VFQFPN
|
RoHs状态:RoHS
|
|
型号:ZSSC3154MCSV1P1
|
制造商:
|
描述:ZSSC3154 MASS CALIBRATION SYSTEM
|
RoHs状态:RoHS
|
|
型号:ZSSC3154BA3R
|
制造商:
|
描述:IC INTFACE SPECIALIZED 32VFQFPN
|
RoHs状态:RoHS
|